Method for forming semiconductor device with modified channel compressive stress

ABSTRACT

A method for forming a semiconductor device provides for forming a gate region on top of a substrate. Gate sidewall liners are formed on opposed sides of the gate region, the sidewall liners having a vertical part contacting sidewalls of the gate region and a horizontal part contacting the substrate. Recessed spacers are formed on top of the sidewall liners. The sidewall liner underneath the spacers is pulled back from the edge of the respective spacer by a predetermined distance. The recessed spacers are formed by reducing the height of the originally formed spacer. The height of the spacers is lower than a height of the gate sidewall liner and the width of the horizontal part of the sidewall liner is shorter than the width of the spacer. The reduced spacer height reduces device channel stress.

RELATED APPLICATION

This patent application is a divisional of U.S. patent application Ser. No. 10/627,849, now U.S Pat. No. 6,975,006 entitled SEMICONDUCTOR DEVICE WITH MODIFIED CHANNEL COMPRESSIVE STRESS, filed Jul. 25, 2003.

BACKGROUND

The present disclosure relates to the fabrication of field-effect transistors in an integrated circuit, and more particularly, relates to methods for modifying mechanical stresses induced upon the transistors' gate channel during the fabrication of transistors which feature the use of sidewall spacers on the transistor gate structures.

Very large scale integrated (VLSI) circuits using field effect transistors (FET) experience problems with the trapping of hot or energetic electrons to affect the lateral electrical field strength and carrier mobility in the transistor gate regions, particularly in the regions adjacent to the device source and drain. As transistor geometric sizing and distances scale down, carrier mobility and channel hot electrons within the FET devices begin to experience greater levels of instability. Many factors can influence this carrier mobility and electron stability. These factors (including substrate structure, substrate doping, source/drain dopant junctions) and gate channel dimensions can be adjustable to some extent during the fabrication of these circuits.

FIG. 1 illustrates a cross-sectional view of a field-effect transistor 100 featuring the use of sidewall spacer films to allow adjustments of the transistors' source/drain dopant junctions. The transistor's gate region comprising of the gate electrode 102, gate sidewall liners 103, and gate oxide 104 is formed on top of a substrate 105. The gate sidewall liners 103 are situated along the side walls of the gate electrode and extends outward to some length from the gate electrode. As shown, the transistor 100 is built upon the semiconductor substrate 105 with isolation structures 106 a and 106 b formed to provide electrical isolation between transistors. The area in the substrate 105 under the gate region is the transistor's gate channel. Sidewall spacers 108 a and 108 b are situated adjacent to the sidewall liners such that the sidewall liners are located directly between the spacers and gate region with the top of the spacers sloping down from the top of the gate sidewall liner to the outer edge of the sidewall liner extension that extends along the substrate from the gate electrode.

Although the spacers 108 a and 108 b offers much improvement for FET control and stability, there is a negative aspect to their use. The stress from the spacers combined with the stress from films subsequently formed on top of the transistor induced upon the gate region will affect the carrier and electron mobility along the gate channel. FIG. 2 illustrates the relationship between the transistor drain current (Id) flow versus stress applied onto the transistor gate channel region for an n-channel metal-oxide-silicon (NMOS) field-effect transistor. Specifically, for NMOS field-effect transistors, drive current improves with reduced stress in the gate channel. Stress affects upon transistor performance, usually accounted for during characterizations of the fabrication processes, have become a larger and more difficult issue as transistor geometric sizing and distances continue to scale down. It has become increasingly more desirable to address the controllability of and levels of stress induced by the spacer layer and subsequent layers on top of the gate region.

What is needed is an improved device with reduced channel stress when the spacers are used.

SUMMARY

A method for making a semiconductor device is disclosed. The semiconductor device has a substrate and a gate region on top of the substrate. It further has a first and second gate sidewall liners situated on a first and second sides of the gate region respectively, the first and second sidewall liners having a vertical part contacting sidewalls of the gate region and a horizontal part contacting the substrate; and a first and second recessed spacers situated on top of the first and second sidewall liners respectively, wherein a height of the first and second spacers is lower than a height of the gate sidewall liner and wherein the width of the horizontal part of the sidewall liner is shorter than the width of the spacer.

In one aspect of the invention, a method is disclosed for fabricating at least one semiconductor device having a gate region and recessed spacers for reducing channel stress. After forming a substrate, a gate region is formed on top of the substrate, the gate region having a gate electrode and a gate oxide region. Two sidewall liners are then formed confining the gate region therebetween, and two spacers are formed on top of the sidewall liners on both sides of the gate region, the height of the spacers matching substantially the height of the sidewall liners. The width of the sidewall liners are shortened so that it is shorter than the spacers on top thereof. Two recessed spacers are formed by reducing the height of the formed spacers, wherein the reduced spacer height reduces device channel stress. The channel stress can further be modified with a contact etching stopper layer placed over the spacers.

According to another aspect, a method for forming a semiconductor device comprises providing a substrate, forming a gate region over the substrate and forming sidewall liners on each of opposed sides of the gate region. Each sidewall liner has a vertical part contacting a respective sidewall of the gate region and a horizontal part contacting the substrate. The method further provides forming a recessed spacer on top of each of the sidewall liners wherein a height of each of the recessed spacers is lower than a height of the corresponding sidewall liner and the horizontal part of each sidewall liner is shorter than the corresponding recessed spacer on top thereof. A contact etch stopping (CES) layer is then formed over the recessed spacers and having a predetermined stress level being one of compressive and tensile.

These and other aspects and advantages will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a cross-sectional side view of a metal-oxide-silicon field-effect transistor (MOSFET) produced by conventional methods with spacers.

FIG. 2 is a graph illustrating the relationship between the drain current of an n-channel field-effect transistor and stress induced upon the transistor channel.

FIG. 3 illustrates a cross-sectional side view of a MOSFET produced in accordance with the first embodiment of the present disclosure.

FIGS. 4A through 4E illustrate cross-sectional side views of a MOSFET at certain fabrication steps in accordance with the second embodiment of present disclosure.

DESCRIPTION

A transistor with modified channel stress and the method for manufacturing same is introduced.

Referring now to FIG. 3, there is shown a cross-sectional side view of a field-effect transistor structure 300 at a predetermined process step of the first embodiment of the present disclosure. The predetermined process step of the first embodiment is the etching of the spacer layers of the transistor to create recessed spacer structures 301 a and 301 b after the formation of the transistors' source and drain regions. The transistor's gate region has a gate electrode 302 formed on top of a gate oxide layer 304. The total height of the gate region may not exceed 1800 Å. A relative thin layer of liner film 303 separates the spacers from the gate materials. The spacer layers is typically comprised of silicon nitride as in this embodiment, but may be of any dielectric material having a different material density property than that of the transistors' semiconductor substrate 305. The liner layer 303 typically is comprised of silicon oxide as in this embodiment, but may be of any dielectric material. The liner layer 303 may be referred as a sidewall liner since it clings on to the exterior side walls of the gate electrode. As it is shown, it can be said that there are two sidewall liners for each gate electrode situated on both sides thereof. The sidewall liner is of an “L” shape with a vertical part contacting the side wall of the gate electrode and a horizontal part contacting the substrate. For the purpose of this disclosure, the width W of the spacer is measured from the widest part thereof and the height H of the spacer is measured from the highest part thereof regardless of the shape of the spacer.

In one example, the width of the gate sidewall liner F is shortened to be at least 10 angstrom shorter than the width of the spacer W. Because the gate sidewall liner has a thickness, the width and the height of the gate sidewall liner actually are both measured from the upper corner 306. Shortening the width of the sidewall liner can be done by depositing a layer of oxide over the device, and then etching off the oxide with a controlled timing. When undergoing the etching, the vertical part of the sidewall liner is etched off slower than the horizontal part. As such, when the oxide is totally removed, the horizontal part is “pulled back” from the edges of the spacers.

A spacer etching process to form the recessed spacers may be applied. It can be of any standard method such as wet chemicals or gaseous/plasma etching, or material selective or non-selective etching, as required to sufficiently create the recessed spacers. The result of the spacer etching is to reduce the spacer to a smaller size. In one example, the height of the spacer H is at least 50 angstrom lower than the height of the gate sidewall liner E.

As shown in FIG. 3, the height of the spacers are shrunk to reduce the stress and the horizontal part of the gate sidewall liner contacting the substrate is also shortened for the same purpose. The horizontal part of the sidewall liner is thus “pulled back” from the edge of the corresponding spacer on its top. In one example, the distance between the pull-back edge of the sidewall liner and the edge of the spacer is at least 10 Å. This pull-back distance can be adjusted based on the need of modification of the stress.

In essence, it is this reduction of the spacer layer and the gate sidewall liner that causes reduced stress level upon the electrical gate channel under the gate regions 302 and 304. It is understood that the net stress level reduction depends on both stress changes from the spacer layer itself, as well as from the modified stress from the thickness of other films such as a contact etch stopper (CES) layer subsequently formed on top of the transistors with the recessed spacers. The amount of spacer material reduction may be tailored during the device fabrication processes to obtain the required amount of net stress change and transistor performance.

Referring now to FIGS. 4A through 4E, there are shown cross-sectional side views of a field-effect transistor structure at certain process steps. FIG. 4A illustrates a semiconductor surface with silicon substrate 401 and transistor isolation structures 402 a and 402 b prior to the fabrication of an FET between the isolation structures. The FET's gate, comprising of gate oxide 403 and gate electrode 404, are shown after being fabricated in FIG. 4B. The transistor's sidewall liner layer 405 is subsequently deposited onto the transistor as illustrated in FIG. 4C. FIG. 4C is also the cross-sectional view of the transistor just prior to the deposition of the transistor's spacer layer.

Through necessary etching process, the liner layer around the transistor will have two “L” shaped sidewall liners confining the gate region in between. It can be seen that the sidewall liners have a vertical part that clings to the side wall 406 of the gate electrode and a horizontal part that lies on top of a portion of the substrate 408. FIG. 4D illustrates the cross-sectional view of the transistor after the liner layer has been properly etched and the transistor's spacer layer has been deposited to complete the formation of the isolated spacer structures 410 a and 410 b around the transistor. At this point, the spacers are generated with the top of the spacers sloping down from the top of the gate sidewall liner down. It is understood that the spacers can deposited first before the “L” shaped sidewall liners are “pulled back” to its desired shortened width.

FIG. 4E illustrates the result of further etching processes to make recessed spacers to reduce the channel stress. In this example, the height of the spacers is reduced to be at least 50 Å lower than the original height as shown in FIG. 4D.

In addition, an ion implantation process can be applied to the transistor' spacer layers 410 a and 410 b with a dopant 412 to provide the relaxation of the stress within the spacer layer, thus resulting in a reduction of stress upon the gate channel region. This process step may be performed either before or after the formation of the transistors' source and drain regions. The ion implant species of this embodiment may be silicon or germanium as well as any other ion such as SiN, which will relax the spacer stress while providing minimal affects to other performance characteristics of the device. The ion implant energy of this embodiment is typically in the range of 40 to 100 electron kilovolts for silicon and germanium ions, but may vary depending on different process technologies. The ion implant range is carefully chosen such that placement of the ions within the spacer layer will result in the required modification to the film's stress property. Ion implant dosage of this embodiment is typically in the dose range of 1.00E14 to 1.00E15 ions per square centimeter for silicon and germanium ions. The ion implant dosage level is chosen such that the required stress property modification is made to the spacer layer. The stress relaxation in the spacer layer provided by the ion implantation method results with stress relaxation upon the gate channel region of the transistor which in turn, modifies the drive current performance characteristic of the transistors.

The process order of the etching and implant may not be critical, but it is noted that the implantation of the spacers prior to the etching process to make the recessed spacers may eliminate an undesired additional doping of the transistor's source and drain regions through the exposed liner layer adjacent to the recessed spacers. The combination of both the recessed spacers and relaxed levels of stress by ion implantation within the spacer layers will noticeably reduce the gate channel stress.

It is further noticed that a CES layer can then be processed on top of the recessed spacers to further increase the drive current as it is known in the industry. The thickness of the CES layer can be flexible based on the desired feature of the device. The CES layer may impose a compressive stress as well as a tensile stress depending on the type of the device under construction since N type devices and P type devices require different types of stress to perform in their optimal modes. In one example, the level of the stress imposed by the CES is larger than 200 M Pa, and in another example, the tensile stress imposed by the CES can be as high as 1.5 GPa and the compressive stress may be as high as 1 GPa. Generally speaking, the thickness of the CES layer is smaller than 600 Å, and the CES layer is thicker than the recessed spacers. Having a relatively thick CES layer over the top with a recessed spacers enhances the electron/hole mobility in the gate channel underneath the gate region.

Accordingly, it is seen from the above that the device structure and the method for making same according to the present disclosure provide viable solutions to the problems of hot electron trapping and carrier mobility in the gate channel of an FET device, thereby improving the drive current performance of the transistors. It is also noted that the present disclosure provides a solution for the further shrinkage of FET sizes and densities that are manufactured using conventional process methodologies. It is also seen that the present disclosure provides simplified methods for the modification of the net mechanical stress induced by the shape and property of the transistors' spacer layer upon the gate channel. Devices manufactured in accordance with the present disclosure are easily incorporated in currently existing systems.

The embodiments of the present disclosure may be practiced upon any field-effect transistor, which is fabricated upon a semiconductor substrate with a spacer layer contacts the gate electrode sidewalls via a sidewall liner. The field effect transistors upon which the present disclosure may be practiced may have N doped source/drain electrode regions or P doped source/ drain electrode regions. Alternatively, transistor performance of p-channel (PMOS) field-effect transistors may be adjusted to the required performance levels via the stress modification.

The above disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific examples of components, and processes are described to help clarify the invention. These are, of course, merely examples and are not intended to limit the invention from that described in the claims.

While the invention has been particularly shown and described with reference to the preferred embodiment thereof, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention, as set forth in the following claims. 

1. A method for forming a semiconductor device comprising: providing a substrate; forming a gate region over the substrate; forming sidewall liners on each of opposed sides of the gate region, each sidewall liner having a vertical part contacting a respective sidewall of the gate region and a horizontal part contacting the substrate; forming a recessed spacer on top of each of the sidewall liners wherein an uppermost part of each of the recessed spacers is below an uppermost part of the corresponding sidewall liner and the horizontal part of each sidewall liner is shorter than the corresponding recessed spacer on top thereof; and forming a contact etch stopping (CES) layer over the recessed spacers, the CES layer having a predetermined stress.
 2. The method of claim 1 wherein the CES layer imposes a compressive stress being less than 1.0 G Pa.
 3. The method of claim 1 wherein the forming a recessed spacer on top of each of the sidewall liners comprises forming SiN-based recessed spacers.
 4. The method of claim 1 wherein the forming sidewall liners comprises forming oxide-based sidewall liners.
 5. A method for fabricating at least one semiconductor device having a gate structure and recessed spacers, comprising: providing a substrate; forming a gate structure on top of the substrate, the gate structure having a gate electrode and a gate dielectric region; forming a sidewall liner along a side of the gate structure and over the substrate adjacent the gate region; forming a spacer over the sidewall liner, a height of the spacer matching substantially a height of the sidewall liner; reducing a width of the sidewall liner underneath the spacer by causing the sidewall liner to pull back from an edge of the spacer by a predetermined distance; and reducing the height of the spacer to produce a recessed spacer, wherein reduced spacer height reduces device channel stress.
 6. The method of claim 5 wherein the forming a spacer further includes depositing spacer material and etching the deposited spacer material so that the top of the spacer slopes down from the top of the sidewall liner to a horizontal part of the sidewall liner that extends over the substrate adjacent the gate region.
 7. The method of claim 5 wherein the reducing a width further includes: forming an oxide layer over the spacer, the sidewall liner, and the gate structure and etching the oxide layer off within a predetermined time period.
 8. The method of claim 5 wherein the reducing the height of the spacer comprises selectively etching and reducing the height by at least 50 Å.
 9. The method of claim 5 further comprising introducing one or more impurities to the spacer to further reduce the device channel stress.
 10. The method of claim 5 wherein the predetermined distance is at least 10 Å.
 11. The method of claim 5 further comprising forming a contact etch stopper (CES) layer over the recessed spacer thereby further modifying the device channel stress.
 12. The method of claim 11 wherein the CES layer imposes a compressive stress.
 13. A method for forming a semiconductor device including a transistor, the method comprising: providing a substrate; forming a gate electrode over the substrate; forming an “L” shaped gate sidewall liner along the gate electrode and having a vertical part contacting a sidewall of the gate electrode and a horizontal part contacting the substrate; forming a recessed spacer over the sidewall liner; introducing predetermined impurities into the recessed spacer for modifying a channel stress of the transistor; and forming a contact etching stopper (CES) layer over the recessed spacer, wherein an uppermost part of the recessed spacer is below an uppermost part of the vertical part of the gate sidewall liner and a width of the horizontal part of the gate sidewall liner is less than a width of the spacer.
 14. The method of claim 13 wherein the impurities introduced into the recessed spacer include at least one of Ge, Ar, and O2.
 15. The method of claim 13 wherein the forming a recessed spacer comprises forming a spacer over the sidewall liner and selectively etching the spacer to reduce a height of the spacer by at least 50 Å to form the recessed spacer.
 16. The method of claim 13 wherein the forming a contact etching stopper layer includes forming the contact etching stopper layer to impose a stress.
 17. The method of claim 16 wherein the contract etching stopper layer imposes a compressive stress less than 1.0 G Pa. 